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Introduction
We can make single/double sided board, multi-layer board, high density board, including MLB with blind/buried via holes
Main Base Material
FR-1, FR-2, FR-4, CEM-1, CEM-3, High Frequency Laminate with various dielectric constant (imported or from local supplier), Aluminum base laminate, Metal core Aluminum
We choose the best base material suppliers as our partners, such as KB and Shengyi to guarantee our products with high quality.
Surface Finish
Hot air Lev p lead free HASL, immersion gold/silver/tin, plating gold, OSP
Board Thickness
Inner core thickness 0.15-1.5mm, finished board thickness 0.20-3mm
Service
*- Comprehensive documents audit to prevent mistakes in PCB Gerber and Bom.
*- Suggest best quality replacement with lower price.
*- Engineering support for test and provide suggestions for mass production.
*- Suggest best shipment method.
*- Sign NDA to keep your design safe.
Product Details:
Payment & Shipping Terms:
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| Number Of Layers: | 4-Layer | Base Material: | FR4 |
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| Copper Thickness: | 1.0OZ | Board Thickness: | 1.5mm |
| Min. Hole Size: | 0.10mm | Min. Line Width: | 3mil |
| Min. Line Spacing: | 3mil | Surface Finishing: | ENIG+OSP |
| Soldermask Color: | Green | ||
| High Light: | cell phone circuit board,mobile phone circuit board |
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We can produce single-sided printed board(ssb), double-sided printed board(dsb), multilayer PCBs, HDI PCBs, FPC and PCBA according to your provided Data Files or your sample.
Introduction of our craft capability :
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Specifications |
Details |
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Material Type |
FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont |
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Material Thickness ( in inches) |
0.062”, 0.080”, 0.093”, 0.125”, 0.220”, 0.047”, 0.031”, 0.020”, 0.005" |
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Layer count |
1 to 28 Layers |
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Max. Board Size |
23.00” x 35.00”(580mm*900mm) |
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IPC Class |
Class II, Class III , Class 1 |
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Annular Ring |
5 mil/side or Greater (Min. Design) |
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Finish Plating |
Solder(HASL), Lead Free Solder(HASL), ENIG (ELectroless Nickel Immersion Gold), OSP, Immersion Silver,Immersion Tin, Immersion Nickel, Hard Gold, Other |
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Copper Weight |
0.5OZ-7OZ |
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Trace/Space Width |
3 Mils or Greater |
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Drill Clearance |
0.1mm(laser drilling) |
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Plated Slots |
0.036 or Greater |
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Smallest Hole (Finished) |
0.1mm or Greater |
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Gold Fingers |
1 to 4 Edge (30 to 50 Micron Gold) |
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SMD Pitch |
0.080” - 0.020” - 0.010” |
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Soldermask Type |
LPI Glossy, LPI-Matte, SR1000 |
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Soldermask Color |
Green, Red, Blue, Black, White, Yellow, |
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Legend Color |
White, Yellow, Black, Red, Blue |
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CNC Route Point |
Any |
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Minimum Route Width |
0.031” |
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Scoring |
Straight Lines, Jump Scoring, Panel Edge to Edge, CNC* |
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Body Gold |
HARD*, IMMERSION* (up to 50 MICRON GOLD) |
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Data File Format |
Gerber 274x with embedder aperture |
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Fab. Drawing Format |
DXF, HPGL, DWG, PDF, Gerber |
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E.T Testing |
Flying Probe, Single Sided, 1up Plate, Clampshell, Net List |
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Counter Sink / Counter Bore |
Availiable up to 0.250 Diameter |
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Control Impedence |
Yes |
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Blind Vias / Buried Vias |
Yes |
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Peelable Mask |
Yes |
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Carbon |
Yes |
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
