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Introduction
We can make single/double sided board, multi-layer board, high density board, including MLB with blind/buried via holes
Main Base Material
FR-1, FR-2, FR-4, CEM-1, CEM-3, High Frequency Laminate with various dielectric constant (imported or from local supplier), Aluminum base laminate, Metal core Aluminum
We choose the best base material suppliers as our partners, such as KB and Shengyi to guarantee our products with high quality.
Surface Finish
Hot air Lev p lead free HASL, immersion gold/silver/tin, plating gold, OSP
Board Thickness
Inner core thickness 0.15-1.5mm, finished board thickness 0.20-3mm
Service
*- Comprehensive documents audit to prevent mistakes in PCB Gerber and Bom.
*- Suggest best quality replacement with lower price.
*- Engineering support for test and provide suggestions for mass production.
*- Suggest best shipment method.
*- Sign NDA to keep your design safe.
Product Details:
Payment & Shipping Terms:
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| Base Material: | FR-4 | Copper Thickness: | 1.0oz |
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| Board Thickness: | 1.5 Mm | Min. Hole Size: | 0.25 Mm |
| Min. Line Width: | 0.12 Mm | Min. Line Spacing: | 0.12 Mm |
| Surface Finishing: | Flash Gold | Color: | Green |
| Layers: | 2-layer | ||
| High Light: | mobile phone pcb,mobile phone circuit board |
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WonDa is professional and reliable PCB manufacturer which is located in Guangdong, China. It's specialized in manufacturing single side PCB, double side PCB, multilayer PCB, especially in aluminum PCB, DVD PCB and power supply PCB.
We choose the best base material suppliers as our partners, such as KB and Shengyi to guarantee our products with high quality.
Below information about our company's process capacity for your reference:
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Product Categories: |
single/double sided board, multi-layer board, high density board, including MLB with blind/buried via holes |
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Main base material: |
FR-1, FR-2, FR-4, CEM-1, CEM-3, High Frequency Laminate with various dielectric constant (imported or from local supplier), Aluminum base laminate, Metal core Aluminum |
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Surface Finish: |
Hot air Lev p lead free HASL, immersion gold/silver/tin, plating gold, OSP |
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Board Thickness: |
Inner core thickness 0.15-1.5mm, finished board thickness 0.20-3mm |
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Copper Foil Thickness: |
1/3 OZ–5 OZ (18um – 175um) |
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Min. hole size: |
0.2mm/8mil |
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Min. line width: |
0.1mm/4mil |
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Min. spacing: |
0.1mm/4mil |
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Maximum Size: |
600mm x 10000mm |
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Min. Size: |
5mm x 10mm |
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Solder Mask Type: |
Liquid photo-imageable, Thermosetting solder, UV solder mask |
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Outline Tolerance: |
±0.13mm(r0. ±0.13mm(routing), ±0.05mm(punching) |
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Inner Layer registration tolerance: |
±0.05mm |
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Production capacity per month: |
≥10000sqm |
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
