Introduction
PCB Assembly is a process that requires knowledge not just of PCB components and assembly but also of printed circuit board design, PCB fabrication and a strong understanding of the final product. Circuit board assembly is just one piece of the puzzle to delivering the perfect product the first time.
San Francisco Circuits is a one-stop solution for all circuit board services so we are often entrenched with the PCB production process from design to assembly. Through our strong network of well-proven circuit assembly and manufacturing partners, we can provide the most advanced and nearly limitless capabilities for your prototype or production PCB application. Save yourself the trouble that comes with the procurement process and dealing with multiple components vendors. Our experts will find you the best parts for your final product.
PCB Assembly Services:
Quick-turn prototype assembly
Turn-key assembly
Partial turn-key assembly
Consignment assembly
RoHS compliant lead-free assembly
Non-RoHS assembly
Conformal coating
Final box-build and packaging
PCB Assembly Process
Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing
Testing Services
X-Ray (2-D and 3-D)
BGA X-Ray Inspection
AOI Testing (Automated Optical Inspection)
ICT Testing (In-Circuit Testing)
Functional Testing (at the board & system level)
Flying Probe
Capabilities
Surface Mount Technology / Parts (SMT Assembly)
Through-Hole Device / Parts (THD)
Mixed Parts: SMT & THD assembly
BGA / Micro BGA / uBGA
QFN, POP & lead-less chips
2800 pin-count BGA
0201 / 1005 passive components
0.3 / 0.4 Pitch
PoP Package
Flip-chip under-filled CCGA
BGA Interposer / Stack-up
and more…
Product Details:
Payment & Shipping Terms:
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Base Material: | FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic,crockery,Metal | Copper Thickness: | 1/2 Oz Min; 12 Oz Max |
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Board Thickness: | 0.2mm-6mm(8mil-126mil) | Min. Hole Size: | 0.1mm(4mil) |
Min. Line Width: | 0.075mm(3mil) | Min. Line Spacing: | 0.1mm(4mil) |
Surface Finishing: | HASL / HASL Lead Free, Chemical Tin, Chemical Gold, Immersion Gold | Cerificate: | ISO9001/TS16949/IPC/ROHS/UL |
High Light: | printed circuit board assembly,pcb prototype assembly |
6 Rigid-flex PCB;Flex-rigid printed circuit;Fpc/Pcb Manufacture;China Fpc supplier;PCB designer;PCB service
We can prvide a package of service:
· 1. PCB layout, PCB design;
· 2: Make high difficulty PCB(1 to 38 layers)
· 3: Provide all Electronic components;
· 4: PCB assembly;
· 5: Write programs for clients;
· 6: PCBA/finished product Test.
Our advantaged products and service:
PCB Layout,PCBA Factory,HDI PCB,Printed circuit board,BGA PCB,Printed circuit board,Heavy copper PCB,Heavy Au PCB,Heavy Gold PCB,Ceramic PCB,Pottery,PCB.Crockery PCB.FPC,FPCA,Flexible PCB/Printed circuit boards,Flexible PCB assembly. Carbon Oil PCB,Carbon Printed circuit boards.High TG PCB,All Electronic Components,PCB Assembly,Write programs,PCBA test.
Specification for FPC Manufacture:
Item |
FPC |
PCB |
Rigid Flex |
Layers |
1-8 layers |
1-38 layers |
2-4 layer |
Board Thickness |
0.05-0.5mm |
0.2-5mm |
0.3-2.2mm |
Min.line width/space |
0.04/0.04mm |
0.075/0.075mm |
0.1/0.1mm |
Min.Through Hole Size |
0.2mm |
0.25mm |
0.5mm |
PTH Hole Dia.Tolerance |
&≤0.8mm 0.05mm |
&≤0.8mm ±0.05mm |
&≤0.8mm ±0.05mm |
Solder Mask Registration Tolerance |
±0.05mm |
±0.05mm |
±0.05mm |
Min.Routing Dimension Tolerance |
±0.05mm |
±0.1mm |
±0.1mm |
Hole to edge(Hard tool/Die Cut) |
±0.1/±0.2mm |
|
|
Eege to Edge(Hard tool/Die Cut) |
±0.05/±0.2mm |
|
|
Circuit to edge(Hard tool/Die Cut) |
±0.07/±0.2mm |
|
|
Surface Treating Technology |
Electrical Flash Gold,Anti-Tarnish(OSP), |
Details of tech:
PCB/ PCBA Technic
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345