 |
|
Introduction
PCB Assembly is a process that requires knowledge not just of PCB components and assembly but also of printed circuit board design, PCB fabrication and a strong understanding of the final product. Circuit board assembly is just one piece of the puzzle to delivering the perfect product the first time.
San Francisco Circuits is a one-stop solution for all circuit board services so we are often entrenched with the PCB production process from design to assembly. Through our strong network of well-proven circuit assembly and manufacturing partners, we can provide the most advanced and nearly limitless capabilities for your prototype or production PCB application. Save yourself the trouble that comes with the procurement process and dealing with multiple components vendors. Our experts will find you the best parts for your final product.
PCB Assembly Services:
Quick-turn prototype assembly
Turn-key assembly
Partial turn-key assembly
Consignment assembly
RoHS compliant lead-free assembly
Non-RoHS assembly
Conformal coating
Final box-build and packaging
PCB Assembly Process
Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing
Testing Services
X-Ray (2-D and 3-D)
BGA X-Ray Inspection
AOI Testing (Automated Optical Inspection)
ICT Testing (In-Circuit Testing)
Functional Testing (at the board & system level)
Flying Probe
Capabilities
Surface Mount Technology / Parts (SMT Assembly)
Through-Hole Device / Parts (THD)
Mixed Parts: SMT & THD assembly
BGA / Micro BGA / uBGA
QFN, POP & lead-less chips
2800 pin-count BGA
0201 / 1005 passive components
0.3 / 0.4 Pitch
PoP Package
Flip-chip under-filled CCGA
BGA Interposer / Stack-up
and more…
Product Details:
Payment & Shipping Terms:
|
| Base Material: | FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic,crockery,Metal | Copper Thickness: | 1/2 Oz Min; 12 Oz Max |
|---|---|---|---|
| Board Thickness: | 0.2mm-6mm(8mil-126mil) | Min. Hole Size: | 0.1mm(4mil) |
| Min. Line Width: | 0.075mm(3mil) | Min. Line Spacing: | 0.1mm(4mil) |
| Surface Finishing: | HASL / HASL Lead Free, Chemical Tin, Chemical Gold, Immersion Gold | Insulation Resistance: | 10Kohm-20Mohm |
| Test Voltage: | 10-300V | ||
| High Light: | printed circuit board assembly,pcb prototype assembly |
||
OEM Induction Cooker PCB Board Assembly
1.PCB Layout,PCB design
2.Make high difficulty PCB(1-38 layers boards)
3.offer all Electric components
4.ISO9001/TS16949/ROHS
5.PCB delivery time:5-10 days; PCBA delivery time:20-25 days
We are professional manufacturer in various PCB and PCBA with many years experience,We can provide a reasonable price with high quality products.
* 1. PCB layout, PCB design
* 2: Make high difficulty PCB(1 to 38 layers)
* 3: Provide all Electronic component
* 4: PCB assembly
* 5: Write programs for clients
* 6: PCBA/finished product Test. etc.
PCB Specification detail
| Item | Specification | |
| 1 | Numbr of Layer | 1-38Layers |
| 2 | Material | FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate |
| 3 | Finish Board Thickness | 0.2mm-6.00 mm(8mil-126mil) |
| 4 | Minimun Core Thickness | 0.075mm(3mil) |
| 5 | Copper Thickness | 1/2 oz min;12 oz max |
| 6 | Min.Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
| 7 | Min.Hole Diameter for CNC Driling | 0.1mm(4mil) |
| 8 | Min.Hole Diameter for punching | 0.9mm(35mil) |
| 9 | Biggest panel size | 610mm*508mm |
| 10 | Hole Positon | +/-0.075mm(3mil) CNC Driling |
| 11 | Conductor Width(W) | 0.05mm(2mil)or;+/-20% of original artwork |
| 12 | Hole Diameter(H) | PTH L:+/-0.075mm(3mil);Non-PTH L:+/-0.05mm(2mil) |
| 13 | Outline Tolerance | 0.125mm(5mil) CNC Routing;+/-0.15mm(6mil) by Punching |
| 14 | Warp & Twist | 0.70% |
| 15 | Insulation Resistance | 10Kohm-20Mohm |
| 16 | Conductivity | <50ohm |
| 17 | Test Voltage | 10-300V |
| 18 | Panel Size | 110×100mm(min);660×600mm(max) |
| 19 | Layer-layer misregistration | 4 layers:0.15mm(6mil)max;6 layers:0.25mm(10mil)max |
| 20 | Min.spacing between hole edge to circuity pqttern of an inner layer | 0.25mm(10mil) |
| 21 | Min.spacing between board oulineto circuitry pattern of an inner layer | 0.25mm(10mil) |
| 22 | Board thickness tolerance | 4 layers:+/-0.13mm(5mil);6 layers:+/-0.15mm(6mil) |
| 23 | Impedance Control | +/-10% |
| 24 | Different Impendance | +-/10% |
Details for PCB Assembly
Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
Quote requirement
1).The detailed files(Gerber files,specification and BOM);
2).Clear pictures of PCBA or samples for us;
3).PCBA Test method.
Contact Person: admin
