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Material
FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum
Surface finish/treatment
HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating
Certification
UL Approval
ROHS
ISO9001:2000
CE certification
SGS Lead-free certification
What can we do for you?
We provide following service to all of our customers:
1. PCB production service. Available on FR-4, TG150-180, Aluminum, FPC
2. PCB copy service
3. PCB assembly service. Available on SMT, BGA, DIP.
4. And Box build assemble. Available on Final Functional testing and final package
5. Electronic Component purchasing service
The following information is requested for this service:
*Gerber files of the bare PCB
*Bill of materials to include: Manufacturer's part number, type of part, type of packaging, component locations listed by reference designators and quantity
*Dimensional specifications for non-standard components
*Assembly drawing, including any change notices
*Final test procedures (if available)
Product Details:
Payment & Shipping Terms:
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| Base Material: | FR4 CEM1 94Vo 94HB | Copper Thickness: | 1/2-4oz |
|---|---|---|---|
| Board Thickness: | 0.2mm--3.2mm | Min. Hole Size: | 0.2mm(8mil) |
| Min. Line Width: | 0.075mm(3mil) | Min. Line Spacing: | 0.075mm(3mil) |
| Surface Finishing: | Lead Free HASL | Color: | Green |
| Basic Material: | FR4cem1 | Finish: | HASL,ENIG,Pb Free,OSP |
| Key Word: | Electronic Cigarette Pcb Board | ||
| High Light: | electronic pcb assembly,electronic circuit board |
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Min Thickness (Inner Layer Residue Copper 0.5oz, Resdiue Copper Rate 65%) | 4L | 6L | 8L | 10L | 12L | 14L |
16 mils | 24 mils | 32 mils | 40 mils | 48 mils | 56 mils | |
Min/Max Layer Count | Min 2 Layer, Max 20 Layer | |||||
Min Inner Layer Thickness | 4 mils | |||||
Min Trace / Space | 4/4 mils Protype 3/3 mils Copper (Thickness 1/ 3oz) | |||||
Min Finished Hole Size | 8 mils (Aspect Ratio 5) | |||||
Drilling Accuracy | ±3 mil | |||||
Lamination Evenness | ±3 mil | |||||
Min Channel of SMD Pitch | 10 mil | |||||
Min Channel of SMD Pitch | 8 mil | |||||
Min DAM Between Fine Pitch | 4 mil | |||||
Min Space of Soldermask | 4 mil | |||||
Layer To Layer Registration Tollence | ±3 mil | ±3 mil | ±3 mil | ±3 mil | ±3 mil | ±3 mil |
Impedance Control Tollance | 100 | |||||
100 ±10%, 50 ±10% | ||||||
Board Bow / Twist Tolerance | < 0.75% | |||||
Min Length (V-Cut) | 2 inch | |||||
Max Width (V-Cut) | 29 inch | |||||
Min Width (V-Cut) | 2 inch | |||||
Min Board Thickness (V-Cut) | 12 mils | |||||
Golden Finger Max Width Beveling | 70 mils | |||||
Max Working Size | 29 x 22.44 inch | |||||
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
