NO 

         Item

 Craft Capacity

1               

Layer                                                  

1-28 Layers                                                                                

2

Base Material for PCB

FR4, CEM-1, TACONIC, Aluminium, 

High Tg Material, High Frequence ROGERS ,

TEFLON, ARLON, Halogen-free Material

3

Rang of finish baords Thickness

0.21-7.0mm

4

Max size of finish board

900MM*900MM

5

Minimum Linewidth

3mil (0.075mm)

6

Minimum Line space

3mil (0.075mm)

7

Min space between pad to pad

3mil (0.075mm)

8

Minimum hole diameter

0.10 mm

9

Min bonding pad diameter

10mil

10

Max proportion of drilling hole and board thickness

1:12.5

11

Minimum linewidth of Idents

4mil

12

Min Height of Idents

25mil

13

Finishing Treatment

HASL (Tin-Lead Free),

ENIG(Immersion Gold), 

Immersion Silver , 

Gold Plating (Flash Gold),OSP, etc.

14

Soldermask

Green, White, Red,

Yellow, Black, Blue, 

transparent photosensitive soldermask, 

Strippable soldermask.

15

Minimun thickness of soldermask

10um

16

Color of silk-screen

White, Black, Yellow ect.

17

E-Testing

100% E-Testing (High Voltage Testing);  

Flying Probe Testing 

18

Other test

ImpedanceTesting,Resistance Testing, 

Microsection etc.,

19

Date file format

GERBER FILE and DRILLING FILE, 

PROTEL SERIES, PADS2000 SERIES, 

Powerpcb SERIES, ODB++

20

Special technological requirement

Blind & Buried Vias and 

High Thickness copper

21

Thickness of Copper

0.5-14oz (18-490um)