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Material
FR4 fiberglass panels, aluminum plate, copper substrate, iron substrate, PTFE, F4B, F4BM, Kangtai Li, CER-10, Rogers, FPC soft board and some other high-precision plate.
Crafts
Light copper, nickel, gold, tin spray; Immersion Gold, antioxidant, HASL, immersion tin, etc.
Double Layer PCB Leadfree HASL with blue solder mask
- Leadfree HASL Surface finish required to meet ROHS compliant
-FR-4 material with 0.25mm-6mm boards thickness
-Copper weight:1/3OZ,0.5OZ,1OZ,2OZ,3OZ,4OZ,5OZ,6OZ
-3-3mils min track width & spacing -0.2mm min finished hole size
-Certificate: UL,ISO14001,TS16949 and ROHS
-Company management: ISO9001
-Markets: Europe, America, Asia,etc.
Application
electronic products, like
computer peripherals,aerospace,telecommunication,automotives,medicaldevices,camermas,optoelectronic devices,VCD,LCD and verious other comsumer electronic products.
Product Details:
Payment & Shipping Terms:
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| High Light: | custom printed circuit boards,2 layer pcb |
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|---|---|---|---|
ENIG pcb, pcb design, Tg150,Tg170 2-Layer pcb, pcb thickness 0.20mm - 6.0mm
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PCB Main Technical Parameters |
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Item |
Technique data |
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Max.Layer |
30 Layers |
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Max board size |
550*1100mm |
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Board thickness |
0.20mm-6.0mm |
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Min.track width |
0.1mm |
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Min.space |
0.1mm |
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Min.diameter for PTH hole |
0.15mm |
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PTH hole dia.tolerance |
0.8+/-0.076mm, 0.8+/-0.10mm |
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Hole position tolerance |
±0.05mm |
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Insulation resistance |
1000000M Ohm |
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Characteristic impedance deviation |
+/-5% |
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Through hole resistance |
300 uOhm |
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Dielectric strength |
1.6Kv/mm |
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Peel-off strength |
1.5N/mm |
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Thermal stress |
235+/-5 C,10sec |
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Flammability |
94V-0 |
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Solderability |
235±5 C,3s |
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Board twist |
<0.005mm/mm |
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Ionic contamination |
<1.56 ug/cm2 |
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Copper thickness |
1/2OZ,1OZ,2OZ,4OZ |
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Plating thickness |
25u m-36um |
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Materials |
FR-4(Tg150,Tg170, Halogen-free) |
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
