 |
|
Testing Procedures For PCB Board
---We perform multiple quality assuring procedures before shipping out any PCB board. These include:
* Visual Inspection
* Flying probe
* Bed of nails
·* Impedance control
·* Solder-ability detection
* Digital metallograghic microscope
·*AOI (Automated Optical Inspection)
Detailed Terms for PCB Manufacturing
---Technical requirement for pcb assembly:
* Professional Surface-mounting and Through-hole soldering Technology
* Various sizes like 1206,0805,0603 components SMT technology
* ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
* PCB Assembly With UL,CE,FCC,Rohs Approval
* Nitrogen gas reflow soldering technology for SMT.
* High Standard SMT&Solder Assembly Line
* High density interconnected board placement technology capacity.
Surface Treatment
Lead-free HAL
Gold Plating (1-30 micro inch)
OSP
Silver Plating
Pure Tin Plating
Immersion Tin
Immersion Gold
Gold Finger
Other Service:
A) We have many special material as rogers, teflon, taconic, Fr-4 high tg, Ceramic in stock. Welcome to send us your inquiry.
B) We also provide sourcing components , PCB design , PCB copy , PCB drawing , PCB assembly and so on .
Product Details:
Payment & Shipping Terms:
|
| High Light: | led lighting board,high power led pcb |
||
|---|---|---|---|
8 Layer Custom 1.6m Immersion Tin FR4 Rigid PCB Printed Circuit Board Fabrication For LED
applicaton:
Products are applied to a wide range of High-tech industries such as: LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.
|
SPECIFICATION |
||||
|
Materials |
Polyimide |
Polyester ( PET) |
Remark& |
|
|
(Kapton) |
Test Method |
|||
|
|
|
1~8(Rigid-Flex & Multilayers FPC) |
1~2 |
|
|
|
Single Sided |
0.050 mm |
|
|
|
|
Double Sided |
0.075 mm |
|
|
|
|
Drilling P.T.H. |
0.2 mm |
|
|
|
|
Punching |
1.0 mm |
|
|
|
|
Conductor Width (W) |
0.025 mm |
W0.5mm |
|
|
|
Hole Diameter (H) |
0.05 mm (withP.T.H.0.1mm) |
H1.5mm |
|
|
|
Accumulated Pitch (P) |
0.05 mm (Special0.03mm) |
P25mm |
|
|
|
Outline Dimension (L) |
0.05 mm |
L50 mm |
|
|
|
Conductors and Outline (C) |
0.15 mm (Special 0.07mm) |
C5.0 mm |
|
|
|
Conductors and Coverlay |
0.3~0.5 mm |
|
|
|
Surface Treatment on |
Soft or Hard Ni/Au Sn/Pb (2~60μm) Primary FluxCarbon Printed 4~10μm Silver Gel printed |
|
||
|
Terminals and land Areas |
||||
|
Insulation Resistance |
1000MW |
IPC-TM-650 2.6.3.2 |
||
|
at Ambient |
||||
|
Dielectric Strength |
5KV |
IPC-TM-650 2.5.6.1 |
||
|
Surface Resistance (W) |
5x012 |
2x015 |
IPC-TM-650 2.5.17 |
|
|
Volume Resistivity (W-cm) |
1x015 |
1x015 |
IPC-TM-650 2.5.17 |
|
|
Dielectric Constant (1 MHz) |
4 |
3.4 |
IPC-TM-650 2.5.5.3 |
|
|
Dissipation Factor (1 MHz) |
0.04 |
0.02 |
IPC-TM-650 2.5.5.3 |
|
|
Peeling Strength (180 irection) |
1.2kgf/cm |
1.2kgf/cm |
IPC-TM-650 2.4.9 |
|
|
Solder Heat Resistance |
260 .C/10secs |
210 .C/3secs |
||
|
Flammability |
94 V-0 |
94VTM-0 |
UL94 |
|
|
Water Absorption |
2.90% |
1.00% |
ASTM D570% |
|
|
(24 Hours) |
||||
Material: FR4
Surface treatment: immersion Tin
Width/space: 3.5/3.5mil
Finish thickness: 1.6m
Min Hot:0.2mm
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
