Material
FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
Surface Treatment
HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
Advantage
1.PCB factory directly
2.PCB high quality
3.PCB good price
4.PCB quick time
5.PCB certification(ISO/UL E354810/RoHS)
Capability:
-High Frequency (TACONIC material)/TG/Density/precision impedance controlled boards
-Heavy Copper PCB, Metal based PCB. Hard Gold PCB, Blind &Buried vias boards,
Halogen Free PCB, Aluminum-backed Boards
-Gold finger+ HAL & Leadfree HASL PCB, Leadfree compatible PCB
Product Details:
Payment & Shipping Terms:
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| Highlight: | high density board,hdi circuit boards |
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|---|---|---|---|
4 Layer High Density Interconnected PCB for Cellphone Charger Cable
Key Specifications/Special Features
| Number. of Layers: | 4 |
| Laminate Material: | FR4 |
| Surface Finish: | ENIG, Gold Thickness: 4U |
| Copper Thickness: | 1 OZ |
| Board Thickness: | 1.6mm (0.062”) |
| Board Size: | |
| Color of Mask: | White |
| Color of Silkscreen: | Black with Non-Conductive Ink |
| Flammability: | UL 94V-0 |
| Workmanship: | Compliance with IPC-A-600 & IPC-6012 CLASS II |
| Thermal Conductivity | - |
Capacity
| High precision prototype | PCB bulk production | ||
| Max Layers | 1-28 layers | 1-14 layers | |
| MIN Line width(mil) | 3mil | 4mil | |
| MIN Line space(mil) | 3mil | 4mil | |
| Min via (mechanical drilling) | Board thickness≤1.2mm | 0.15mm | 0.2mm |
| Board thickness≤2.5mm | 0.2mm | 0.3mm | |
| Board thickness>2.5mm | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
| Aspect Ration | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
| Board thickness | MAX | 8mm | 7mm |
| MIN | 2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm | 2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm | |
| MAX Board size | 610*1200mm | 610*1200mm | |
| Max copper thickness | 0.5-6oz | 0.5-6oz | |
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Immersion Gold/ Gold Plated Thickness |
Immersion Gold:Au,1—8u” Gold finger:Au,1—150u” Gold Plated:Au,1—150u” Nickel Plated :50—500u” |
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| Hole copper thick | 25um 1mil | 25um 1mil | |
| Tolerance | Board thickness | Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8% |
Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8% |
| Outline Tolerance | ≤100mm:+/-0.1mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm |
≤100mm:+/-0.13mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm |
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| Impedance | ±10% | ±10% | |
| MIN Solder mask bridge | 0.08mm | 0.10mm | |
| Plugging Vias capability | 0.25mm--0.60mm | 0.70mm--1.00mm | |
Advantage
1. Factory directly
2. Comprehensive quality control system
3. Competitive price
4. Quick turn: as fast as 48hours.
5. Certification (ISO/ UL E354810/ RoHS)
6. 8 years experience in exporting service
7. No MOQ/MOV.
8. Reliable quality: AOI (Automated Optical Inspection), QA/ QC, flying probe, E-testing, etc
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345