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The board quality is very good! We have been WonDa’s customer for more than 4 years. Your good service and quality is too good.

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Cooperation is very satisfactory and the Company of the past few years, we are very willing to continue long-term cooperation.

—— Rob

The board quality is very good! I’m surprised with the low cost and quick delivery. It is totally out of my expectation. I will definitely come back.

—— Victoria, Australia

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HDI PCB Board

Material

FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180

Surface Treatment

HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger

Advantage

1.PCB factory directly
2.PCB high quality
3.PCB good price
4.PCB quick time
5.PCB certification(ISO/UL E354810/RoHS)

Capability:

-High Frequency (TACONIC material)/TG/Density/precision impedance controlled boards

-Heavy Copper PCB, Metal based PCB. Hard Gold PCB, Blind &Buried vias boards,

Halogen Free PCB, Aluminum-backed Boards

-Gold finger+ HAL & Leadfree HASL PCB, Leadfree compatible PCB

10 Layer BGA High Density Interconnect PCB Immersion Gold Plated

Large Image : 10 Layer BGA High Density Interconnect PCB Immersion Gold Plated

Product Details:

Place of Origin:	China
Brand Name:	LT Circuit
Certification:	UL E354810,SGS

Payment & Shipping Terms:

Minimum Order Quantity:	NO MOQ
Price:	Negotiable
Packaging Details:	20pcs/vacuum bag+export packing
Delivery Time:	5-12Days
Payment Terms:	L/C,T/T,Paypal
Supply Ability:	Ten thousand square meters/month

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Detailed Product Description

Material:	FR4	Layer:	10 Layer
Copper Thickness:	0.5 Oz For Inner Layers And 1 Oz For Outter Layers	Surface Plating:	Immersion Gold
Solder Mask:	Green	Silkscreen:	White
Highlight:	custom circuit board , hdi circuit boards

10 Layer BGA High Density Interconnect PCB Immersion Gold Plated

PCB Capability

		High precision prototype	PCB bulk production
Max Layers		1-28 layers	1-14 layers
MIN Line width(mil)		3mil	4mil
MIN Line space(mil)		3mil	4mil
Min via (mechanical drilling)	Board thickness≤1.2mm	0.15mm	0.2mm
	Board thickness≤2.5mm	0.2mm	0.3mm
	Board thickness＞2.5mm	Aspect Ration≤13:1	Aspect Ration≤13:1
Aspect Ration		Aspect Ration≤13:1	Aspect Ration≤13:1
Board thickness	MAX	8mm	7mm
Board thickness	MIN	2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm	2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm
MAX Board size		*6101200mm**	*6101200mm**
Max copper thickness		0.5-6oz	0.5-6oz
Immersion Gold/ Gold Plated Thickness		Immersion Gold:Au,1—8u” Gold finger:Au,1—150u” Gold Plated:Au,1—150u” Nickel Plated :50—500u”
Hole copper thick		25um 1mil	25um 1mil
Tolerance	Board thickness	Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8%	Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8%
	Outline Tolerance	≤100mm:+/-0.1mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm	≤100mm:+/-0.13mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm
	Impedance	±10%	±10%
MIN Solder mask bridge		0.08mm	0.10mm
Plugging Vias capability		0.25mm--0.60mm	0.70mm--1.00mm

10 Layer BGA High Density Interconnect PCB Immersion Gold Plated

Description

1. Professional manufacturer of PCB and PCB assembly specialized in single-sided PCB, double-sided PCB, multilayer PCB, PCB layout and design and PCB assembly

2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180

3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger

10 Layer BGA High Density Interconnect PCB Immersion Gold Plated

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Contact Person: Miss. aaa

Tel: 86 755 8546321

Fax: 86-10-66557788-2345