Material
FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
Surface Treatment
HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
Advantage
1.PCB factory directly
2.PCB high quality
3.PCB good price
4.PCB quick time
5.PCB certification(ISO/UL E354810/RoHS)
Capability:
-High Frequency (TACONIC material)/TG/Density/precision impedance controlled boards
-Heavy Copper PCB, Metal based PCB. Hard Gold PCB, Blind &Buried vias boards,
Halogen Free PCB, Aluminum-backed Boards
-Gold finger+ HAL & Leadfree HASL PCB, Leadfree compatible PCB
Product Details:
Payment & Shipping Terms:
|
Material: | FR4 | Layer: | 6 Layer |
---|---|---|---|
Copper Thickness: | 1 Oz | Surface Plating: | Immersion Gold |
Solder Mask: | Blue | Silkscreen: | White |
Board Thickness: | 1.6mm | ||
Highlight: | high density board,hdi circuit boards |
Blue BGA HDI Printed Circuit Board with Blind Via Burried Vias
PCB Capability
|
High precision prototype |
PCB bulk production |
|
Max Layers |
1-28 layers |
1-14 layers |
|
MIN Line width(mil) |
3mil |
4mil |
|
MIN Line space(mil) |
3mil |
4mil |
|
Min via (mechanical drilling) |
Board thickness≤1.2mm |
0.15mm |
0.2mm |
Board thickness≤2.5mm |
0.2mm |
0.3mm |
|
Board thickness>2.5mm |
Aspect Ration≤13:1 |
Aspect Ration≤13:1 |
|
Aspect Ration |
Aspect Ration≤13:1 |
Aspect Ration≤13:1 |
|
Board thickness |
MAX |
8mm |
7mm |
MIN |
2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm |
2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm |
|
MAX Board size |
610*1200mm |
610*1200mm |
|
Max copper thickness |
0.5-6oz |
0.5-6oz |
|
Immersion Gold/ Gold Plated Thickness |
Immersion Gold:Au,1—8u” |
|
|
Hole copper thick |
25um 1mil |
25um 1mil |
|
Tolerance |
Board thickness |
Board thickness≤1.0mm:+/-0.1mm |
Board thickness≤1.0mm:+/-0.1mm |
Outline Tolerance |
≤100mm:+/-0.1mm |
≤100mm:+/-0.13mm |
|
Impedance |
±10% |
±10% |
|
MIN Solder mask bridge |
0.08mm |
0.10mm |
|
Plugging Vias capability |
0.25mm--0.60mm |
0.70mm--1.00mm |
Description
1. Professional manufacturer of PCB and PCB assembly specialized in single-sided PCB, double-sided PCB, multilayer PCB, PCB layout and design and PCB assembly
2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
Blind via: It's from one of the surface to any of inner layer.
burried Via: It's via that is between inner layers. burried via is not accessable from top or bottom laye.
Advantage
1.PCB factory directly
2.PCB high quality
3.PCB good price
4.PCB quick time
5.PCB certification(ISO/UL E354810/RoHS)
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345