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Quick Turn Pcb Prototypes For Mobile Phone Circuit Board 8 Layer Surface Osp With Fr4 It180 1.2mm

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Good quality Flexible PCB Board
Good quality Flexible PCB Board
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Flexible PCB Board

  • High Precision Flexible PCB Board suppliers
  • High Precision Flexible PCB Board suppliers
  • High Precision Flexible PCB Board suppliers
  • High Precision Flexible PCB Board suppliers

 

 

Introduction:

 

Flex PCBs, also known as flexible printed circuits or flexible electronics, provide greater options for designers and engineers when assembling electronic circuits.

They are constructed from flexible, high-performance plastic material, usually polyimide, which enables the board to bend or "flex" during use. This flexibility opens them up to use in a wide range of applications.

Quick Turn Pcb Prototypes For Mobile Phone Circuit Board 8 Layer Surface Osp With Fr4 It180 1.2mm

Quick Turn Pcb Prototypes For Mobile Phone Circuit Board 8 Layer Surface Osp With Fr4 It180 1.2mm
Quick Turn Pcb Prototypes For Mobile Phone Circuit Board 8 Layer Surface Osp With Fr4 It180 1.2mm

Large Image :  Quick Turn Pcb Prototypes For Mobile Phone Circuit Board 8 Layer Surface Osp With Fr4 It180 1.2mm

Product Details:

Place of Origin: China
Brand Name: CHITUN
Certification: UL/ISO/ROHS/SGS
Model Number: base on customers' requestion

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: base on gerberfiles
Packaging Details: Vacuum package
Delivery Time: 15-20 days
Payment Terms: TT, LC, Western Union, D/A,, D/P,and others base on negotiation
Supply Ability: 50000 per week
Detailed Product Description
Material: FR4 IT180 Board Thickness: 1.2mm
Copper: 1oz Surface Finish: OSP
Solder Mask: Green Finish: CNC/slot
Standard: IPC Standard
High Light:

quick turn pcb assembly

,

quick turn pcb fabrication

Quick Turn Pcb Prototypes For Mobile Phone Circuit Board 8 Layer Surface Osp With Fr4 It180 1.2mm 

High Density Interconnect (HDI) Boards

ChiTun is a China based manufacturer of High Density Interconnect PCBs (HDI PCBs). Our HDI capabilities include laser microvias, blind and buried vias, fine lines and spaces, sequential lamination, via-in-pad technology. We have provided microelectronic pcbs with fine pitch devices down to 200 microns, using  laser drilled via-in-pad technology and thin build-up materials.

HDI is used widely in the following areas:

  • Chip Packaging
  • Next-Generation Silicon
    testing
  • Supercomputing

 

Upload your data and receive a free consultation and review of your HDI design today or contact us if you need any design help. Experience our expertise and feel the difference.

 

  • Military
  • Aerospace
  • Medical
  • Learn Insider Tips From the Experts!

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