Material
FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
Surface Treatment
HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
Advantage
1.PCB factory directly
2.PCB high quality
3.PCB good price
4.PCB quick time
5.PCB certification(ISO/UL E354810/RoHS)
Capability:
-High Frequency (TACONIC material)/TG/Density/precision impedance controlled boards
-Heavy Copper PCB, Metal based PCB. Hard Gold PCB, Blind &Buried vias boards,
Halogen Free PCB, Aluminum-backed Boards
-Gold finger+ HAL & Leadfree HASL PCB, Leadfree compatible PCB
Product Details:
Payment & Shipping Terms:
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| Material: | FR4/FR1/FR2/CEM-1/CEM-2/ Metal Core | Solder Mask: | Green/Yellow/Red/Black |
|---|---|---|---|
| Quality: | 100% E-TEST | Service: | PCB, PCBA, OEM, ODM |
| Surface Finish: | HASL, OSP, ENIG, HAL, Immersion Tin, Immersion Silver | ||
| Highlight: | multilayer pcb board,multilayer pcb fabrication |
||
CEM-1 HDI PCB FR4 HASL Lead - free PCB Surface 1.0oz Copper ROHS
Characteristics:
1. Professional PCB manufacturer.
2. PCBA,OEM,ODM service are provided.
3. Gerber file needed.
4. Products are 100% E-tested.
5. Quality guarantee and professional after-sale service.
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PRODUCT’S DETAILS |
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Raw Material |
FR-4 (Tg 180 available) |
|
Layer Count |
8-Layer |
|
Board Thickness |
1.6mm |
|
Copper Thickness |
2.0oz |
|
Surface Finish |
ENIG(Electroless Nickel Immersion Gold) |
|
Solder Mask |
Green |
|
Silkscreen |
White |
|
Min. Trace Width/Spacing |
0.075/0.075mm |
|
Min. Hole Size |
0.25mm |
|
Hole Wall Copper Thickness |
≥20μm |
|
Measurement |
300×400mm |
|
Packaging |
Inner: Vacuum-packed in soft plastic bales |
|
Application |
Communication,automobile,cell,computer,medical |
|
Advantage |
Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
|
Special Requirements |
Buried And Blind Via, Impedance Control, Via Plug, |
|
Certification |
UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
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PRODUCTION CAPABILITY OF PCB |
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Process Engineering |
Items |
Manufacturing Capability |
|
Laminate |
Thickness |
0.2~3.2mm |
|
Production Type |
Layer Count |
2L-16L |
|
Cut Lamination |
Max. Working Panel size |
1000×1200mm |
|
Inner Layer |
Internal Core Thickness |
0.1~2.0mm |
|
Internal width/spacing |
Min: 4/4mil |
|
|
Internal Copper Thickness |
1.0~3.0oz |
|
|
Dimension |
Board Thickness Tolerance |
±10% |
|
Interlayer Alignment |
±3mil |
|
|
Drilling |
Manufacture Panel Size |
Max: 650×560mm |
|
Drilling Diameter |
≧0.25mm |
|
|
Hole Diameter Tolerance |
±0.05mm |
|
|
Hole Position Tolerance |
±0.076mm |
|
|
Min.Annular Ring |
0.05mm |
|
|
PTH+Panel Plating |
Hole Wall copper Thickness |
≧20um |
|
Uniformity |
≧90% |
|
|
Outer Layer |
Track Width |
Min: 0.08mm |
|
Track Spacing |
Min: 0.08mm |
|
|
Pattern Plating |
Finished Copper Thickness |
1oz~3oz |
|
EING/Flash Gold |
Nickel Thickness |
2.5um~5.0um |
|
Gold Thickness |
0.03~0.05um |
|
|
Solder Mask |
Thickness |
15~35um |
|
Solder Mask Bridge |
3mil |
|
|
Legend |
Line width/Line spacing |
6/6mil |
|
Gold Finger |
Nickel Thickness |
≧120u〞 |
|
Gold Thickness |
1~50u〞 |
|
|
Hot Air Level |
Tin Thickness |
100~300u〞 |
|
Routing |
Tolerance of Dimension |
±0.1mm |
|
Slot Size |
Min:0.4mm |
|
|
Cutter Diameter |
0.8~2.4mm |
|
|
Punching |
Outline Tolerance |
±0.1mm |
|
Slot Size |
Min:0.5mm |
|
|
V-CUT |
V-CUT Dimension |
Min:60mm |
|
Angle |
15°30°45° |
|
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Remain Thickness Tolerance |
±0.1mm |
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Beveling |
Beveling Dimension |
30~300mm |
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Test |
Testing Voltage |
250V |
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Max.Dimension |
540×400mm |
|
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Impedance Control |
Tolerance |
±10% |
|
Aspect Ration |
12:1 |
|
|
Laser Drilling Size |
4mil(0.1mm) |
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Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345