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Testing Procedures For PCB Board
---We perform multiple quality assuring procedures before shipping out any PCB board. These include:
* Visual Inspection
* Flying probe
* Bed of nails
·* Impedance control
·* Solder-ability detection
* Digital metallograghic microscope
·*AOI (Automated Optical Inspection)
Detailed Terms for PCB Manufacturing
---Technical requirement for pcb assembly:
* Professional Surface-mounting and Through-hole soldering Technology
* Various sizes like 1206,0805,0603 components SMT technology
* ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
* PCB Assembly With UL,CE,FCC,Rohs Approval
* Nitrogen gas reflow soldering technology for SMT.
* High Standard SMT&Solder Assembly Line
* High density interconnected board placement technology capacity.
Surface Treatment
Lead-free HAL
Gold Plating (1-30 micro inch)
OSP
Silver Plating
Pure Tin Plating
Immersion Tin
Immersion Gold
Gold Finger
Other Service:
A) We have many special material as rogers, teflon, taconic, Fr-4 high tg, Ceramic in stock. Welcome to send us your inquiry.
B) We also provide sourcing components , PCB design , PCB copy , PCB drawing , PCB assembly and so on .
Product Details:
Payment & Shipping Terms:
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Cree LED PCB Assembly / Aluminum Based PCB 2.0MM Lead Free
Specifications
Applications
1. Indoor out door decoration.
2. Architectural and boutique atmosphere lighting.
3. Back, concealed , channel letter lighting.
4. Emergency & security, advertisement sign lighting.
5. Holiday Decoration.
PCB capability and services:
1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers)
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test
PCB Assembly services:
SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection
Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design
Certificate:
IPC Standard
ISO9001
ISO/TS16949
UL
Testing and value added services:
AOI (Automatic optical inspection)
ICT(In-circuit test)
Reliability test
X-Ray Test
Analogue and digital function test
Firmware programming
Advantages:
Turnkey manufacturing or quick-turn prototypes
Board-level assembly or complete system integration
Low-volume or mixed-technology assembly for PCBA
Even consignment production
Supoorted capabilities
Factory view:
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
