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Introduction
Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
Material Types
FR-4, CEM-1,CEM-3, IMS, High TG,High Frequency, Halogen Free,Aluminum base, metal core base
Surface Treatment
HASL(LF), Flash gold, ENIG,OSP(Lead free compatible), Carbon ink,
Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger
Production Process
Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.
Application
LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.a
Product Details:
Payment & Shipping Terms:
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| Layer: | 6 | Board Size: | 17*6cm |
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| Board THK: | 1.2mm | Cu THK: | 35UM |
| Panel: | 6*1 | Color: | Green |
| High Light: | printed pcb board,printed circuit board pcb |
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3D Printer Multi-Layer Rigid PCB Circuit Boards With Specialty Metal Core
Quick detail:
| Place of Origin:Guangdong, China (Mainland) |
| Brand Name: XCE |
| Model Number: XCER |
| Number of Layers: 6-Layer |
| Base Material: FR-4 |
| Copper Thickness: inner layers 1oz, outer layers 1.5oz |
| Board Thickness: 62mil |
| Surface Finishing: immersion gold |
Parameter:
| Layer No. | 1-26 | ||||||||
| Min board thickness | 2 layer 0.2mm | ||||||||
| 4 layer 0.4mm | |||||||||
| 6 layer 0.6mm | |||||||||
| 8 layer 0.8mm | |||||||||
| 10 layer 1.0mm | |||||||||
| Max panel size | 508*610mm | ||||||||
| Board thickness tolerance | T≥0.8mm±8%,T＜0.8mm±5% | ||||||||
| Wall hole copper thickness | ＞0.025mm(1mil) | ||||||||
| Finished hole | 0.2mm-6.3mm | ||||||||
| Min line width | 4mil/4mil(0.1/0.1mm) | ||||||||
| Min bonding pad space | 0.1mm(4mil) | ||||||||
| PTH aperture tolerance | ±0.075mm(3mil) | ||||||||
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PCB Capabilities By Market: |
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High Reliability PC Boards |
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-Up to 2000 Thermal cycles |
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2. |
Burn-in Boards |
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-6 Layers - .042" thick |
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-.5 mm pitch |
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-Step-down connectors |
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-Special materials |
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-Large sizes up to 24" x 28" |
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-High Reliability |
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3. |
High Technology Boards |
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-Microelectronics (Line and Space down to .00125"/.00125") |
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-Differential Impedance |
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-Up to 30 Layers |
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-Lead Free process |
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-Special materials |
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-Sequential lamination |
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-Blind and buried vias |
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-Laser Drill |
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-Filled vias |
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-Via in pads |
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-Milspec |
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
