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Single Side Metal Clad PCB Heavy Copper Backed PTFE / Micorowave Printed Circuit Board

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Single Sided PCB

  • High Precision Single Sided PCB suppliers
  • High Precision Single Sided PCB suppliers
  • High Precision Single Sided PCB suppliers
  • High Precision Single Sided PCB suppliers
  • High Precision Single Sided PCB suppliers
  • High Precision Single Sided PCB suppliers

Introduction:

Focus on the most basic of PCB, components focused on one side, the other side of the wire is concentrated.Because wires only appear on one side, so this kind of PCB is called single sided PCB.

Single panel wiring diagram is given priority to with the network printing, that is, in the copper surface printed on resistance agent, to prevent welding resistance after etching printed on mark, and then punching processing way to complete the parts guide hole and the appearance.In addition, part of a small amount of diverse products, are using photosensitive resistance agent forming pattern of the photographic method.

Operating temperatures range from 130 C to 230 C.  Single sided boards are available with surface finishes including Organic surface protectant (OSP), Immersion Silver, Tin, and Gold plating along with both leaded or lead-free Hot Air Solder Level (HASL).


 

                                           
                                           
                                           

Material:

 

 

Single sided PCB base material in paper phenolic copper paper laminated board, epoxy resin copper laminated plate is given priority to.

 

 

Structure:

 

First, the copper foil to be etched, etc. Process to obtain a circuit required, a protective film to be drilled to expose the corresponding pad. After cleaning and then rolling method to combine the two. Then the pad portion exposed gold plating or tin protection.

 

 

Production Process:


Single copper-clad plate - blanking - photochemical method/screen printing image transfer - remove corrosion was printed - cleaning, dry - hole machining - shape - dry cleaning - printing resistance welding coating - cure - printing mark symbol - cure - dry cleaning drying - pre coated flux - a finished product

 


Application

 

Single sided PCB most use in the radio, heating machine, cold storage, washing machines and other electrical appliances product, as well as the printer, vending machines, LED lighting, electronic components, such as commercial machine circuit

 
 

Single Side Metal Clad PCB Heavy Copper Backed PTFE / Micorowave Printed Circuit Board

Single Side Metal Clad PCB Heavy Copper Backed PTFE / Micorowave Printed Circuit Board
Single Side Metal Clad PCB Heavy Copper Backed PTFE / Micorowave Printed Circuit Board Single Side Metal Clad PCB Heavy Copper Backed PTFE / Micorowave Printed Circuit Board

Large Image :  Single Side Metal Clad PCB Heavy Copper Backed PTFE / Micorowave Printed Circuit Board

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS
Model Number: XCES

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
Detailed Product Description
Board THK: 1.0mm Surface Finish: ENIG
Origin: China Cu Thickness: 3OZ
Min Line Space And Width: 5mil Color: Green
Highlight:

single side pcb

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single sided pcb board

Metal Clad Single Sided PCBs Backed PTFE / Micorowave Circuits Maker

 

 

Description:

 

Model: XCES
Layer: 2
Size: 5*9 cm
Special: Metal clad heavy copper
Material: FR4

 

 

Technical Details:

 

    Material: copper basis
    layer count: 1-26L
    Board thickness: 0.2-3.2mm
    Finishing copper thickness: 0.5-4oz
    Solder mask:green
    Silkscreen:white
    Surface Finish: OSP
    Flying probe testing: 100%pass
    Minimum hole size: 0.2mm
    Minimum track width/space: 0.25/0.25mm
    Certificates: UL,SGS,ISO9001:2008

 

Advantage:

  • Blind and/or buried vias
  • Via-in-pad
  • Through vias from surface to surface
  • 20 um circuit geometries
  • 30 um dielectric layers
  • 50 um laser vias
  • 125 um bump pitch processing

FR4 (Tg – 135C, 145C, 170C)
    Rogers Ultralam 2000
    Rogers RO4350
    Rogers RO4003
    Polyimide
    Teflon
    Black FR4
    Getek Copper
    Clad Thermal Substrates
    Hybrid (Rogers and FR4)
    BT Epoxy
    Nelco 4013

 

HASL – Leaded Solder Tin/Nickel  
    HASL – Lead Free Solder
    Electroless Soft Gold
    Wire Bondable Soft Gold
    Nickel Flash Gold
    Electroless Nickel 
    Immersion Gold OSP 
    Electrolytic Nickel /Hard Gold and Selective Gold
    Immersion Silver
    Immersion Tin
    Carbon Ink
    ENIG

 

 Layer: 1 to 36 layers
    Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
    Board thickness: 0.21mm to 3.4mm
    Copper thickness: 0.5 OZ to 4 OZ
    Copper thickness in hole: >25.0 um (>1mil)
Size:
    - Max. Board Size: (580mm×1200mm)
    - Min. Drilled Hole Size: 4mil(0.1mm)
    - Min. Line Width: 3mil (0.075mm)
    - Min. Line Spacing: 3mil (0.075mm)


   Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold,          OSP, Gold plating
   Solder Mask Color: Green/Yellow/Black/White/Red/Blue

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