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Testing Procedures For PCB Board
---We perform multiple quality assuring procedures before shipping out any PCB board. These include:
* Visual Inspection
* Flying probe
* Bed of nails
·* Impedance control
·* Solder-ability detection
* Digital metallograghic microscope
·*AOI (Automated Optical Inspection)
Detailed Terms for PCB Manufacturing
---Technical requirement for pcb assembly:
* Professional Surface-mounting and Through-hole soldering Technology
* Various sizes like 1206,0805,0603 components SMT technology
* ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
* PCB Assembly With UL,CE,FCC,Rohs Approval
* Nitrogen gas reflow soldering technology for SMT.
* High Standard SMT&Solder Assembly Line
* High density interconnected board placement technology capacity.
Surface Treatment
Lead-free HAL
Gold Plating (1-30 micro inch)
OSP
Silver Plating
Pure Tin Plating
Immersion Tin
Immersion Gold
Gold Finger
Other Service:
A) We have many special material as rogers, teflon, taconic, Fr-4 high tg, Ceramic in stock. Welcome to send us your inquiry.
B) We also provide sourcing components , PCB design , PCB copy , PCB drawing , PCB assembly and so on .
Product Details:
Payment & Shipping Terms:
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| Layer: | 2 Layer | Color: | Yellow |
|---|---|---|---|
| Material: | FR4 | Surface: | HASL Lead Free |
| High Light: | fr4 circuit board,printed circuit board |
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2 Layer FR4 PCB Circuit Boards For Emergency Light LED Circuit Board
Specification:
| Layers:2 | Material:FR4 |
| Board thickness:1.6MM | Copper thickness:1OZ |
| Min hole size:10mil | Min line space:10mil |
| Min line width:10mil | Surface:Lead free |
| Solder mask color: yellow | Certificate:Iso9001,SGS |
Parameter:
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Copper thickness in hole |
>25.0 um (>1mil) |
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Size |
Max. Board Size: 23 × 25 (580mm×900mm) |
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Min. Drilled Hole Size: 3mil (0.075mm) |
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Min. Line Width: 3mil (0.075mm) |
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Min. Line Spacing: 3mil (0.075mm) |
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Surface finishing |
HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
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Tolerance
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Shape tolerance: ±0.13 |
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Hole tolerance: PTH: ±0.076 NPTH: ±0.05 |
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Certificate |
UL, ISO 9001, ISO 14001 |
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Special requirements |
Buried and blind vias+controlled impedance +BGA |
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Profiling |
Punching, Routing, V-CUT, Beveling |
| Any other special material please feel free to let us know | |
Description:
Standard products(4, 6 layers), FR4, photo-sensitive soldermask
Special types (thick copper, thin core, hard gold, etc)
High layer count(8-40 layers)
High Density Interconnection (HDI): micro-via technology, build-up construction, laser holes, very small tracks, etc…
Low cost CPTH: polymer conductive holes with copper paste. 4 layers, FR4
Back panels: thick PCBs, press-fit technology, large size PCBs.
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
