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Introduction
PCB Assembly is a process that requires knowledge not just of PCB components and assembly but also of printed circuit board design, PCB fabrication and a strong understanding of the final product. Circuit board assembly is just one piece of the puzzle to delivering the perfect product the first time.
San Francisco Circuits is a one-stop solution for all circuit board services so we are often entrenched with the PCB production process from design to assembly. Through our strong network of well-proven circuit assembly and manufacturing partners, we can provide the most advanced and nearly limitless capabilities for your prototype or production PCB application. Save yourself the trouble that comes with the procurement process and dealing with multiple components vendors. Our experts will find you the best parts for your final product.
PCB Assembly Services:
Quick-turn prototype assembly
Turn-key assembly
Partial turn-key assembly
Consignment assembly
RoHS compliant lead-free assembly
Non-RoHS assembly
Conformal coating
Final box-build and packaging
PCB Assembly Process
Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing
Testing Services
X-Ray (2-D and 3-D)
BGA X-Ray Inspection
AOI Testing (Automated Optical Inspection)
ICT Testing (In-Circuit Testing)
Functional Testing (at the board & system level)
Flying Probe
Capabilities
Surface Mount Technology / Parts (SMT Assembly)
Through-Hole Device / Parts (THD)
Mixed Parts: SMT & THD assembly
BGA / Micro BGA / uBGA
QFN, POP & lead-less chips
2800 pin-count BGA
0201 / 1005 passive components
0.3 / 0.4 Pitch
PoP Package
Flip-chip under-filled CCGA
BGA Interposer / Stack-up
and more…
Product Details:
Payment & Shipping Terms:
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| Material: | FR4 | Layer: | 2 |
|---|---|---|---|
| Color: | Green | Min Line Space: | 10mil |
| Min Line Width: | 10mil | Copper Thickness: | 1OZ |
| Size: | 5*4cm | Board THK: | 1.0MM |
| Panel: | 4*5 | Surface Finish: | HASL |
| Model: | XCEA | Brand: | XCE |
| High Light: | pcb board assembly,PCBA service |
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High Quality Electronics Products PCB / PCBA Assembly Service
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NO |
Item |
Craft Capacity |
|
1 |
Layer |
1-30 Layers |
|
2 |
Base Material for PCB |
FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material |
|
3 |
Rang of finish baords Thickness |
0.21-7.0mm |
|
4 |
Max size of finish board |
900MM*900MM |
|
5 |
Minimum Linewidth |
3mil (0.075mm) |
|
6 |
Minimum Line space |
3mil (0.075mm) |
|
7 |
Min space between pad to pad |
3mil (0.075mm) |
|
8 |
Minimum hole diameter |
0.10 mm |
|
9 |
Min bonding pad diameter |
10mil |
|
10 |
Max proportion of drilling hole and board thickness |
1:12.5 |
|
11 |
Minimum linewidth of Idents |
4mil |
|
12 |
Min Height of Idents |
25mil |
|
13 |
Finishing Treatment |
HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc. |
|
14 |
Soldermask |
Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask. |
|
15 |
Minimun thickness of soldermask |
10um |
|
16 |
Color of silk-screen |
White, Black, Yellow ect. |
|
17 |
E-Testing |
100% E-Testing (High Voltage Testing); Flying Probe Testing |
|
18 |
Other test |
ImpedanceTesting,Resistance Testing, Microsection etc., |
|
19 |
Date file format |
GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++ |
|
20 |
Special technological requirement |
Blind & Buried Vias and High Thickness copper |
|
21 |
Thickness of Copper |
0.5-14oz (18-490um) |
Product type:
Single-sided, double-sided and multilayer printed circuit boards (PCB), flexible (soft) of circuit boards, blind buried plate.
Max size: single-sided, double-sided: 1000mm * 600mm MLB: 600mm * 600mm
Highest Number of floors: 20 floors
Processing board thickness: 0.4mm -4.0mm rigid plate flexible plate 0.025mm --- 0.15mm
Copper foil substrate thickness: rigid plate 18μ (1 / 2OZ), 35μ (1OZ), 70μ (2OZ) flexible board 0.009MM 0.018mm 0.035mm 0.070mm 0.010mm
Common substrates: FR-4, CEM-3, CEM-1, 94HB, 94VO, poly vinyl chloride, polyester, polyimide ammonium.
Process Capability:
(1) Drilling: Minimum aperture 0.15MM
(2) metal hole: Minimum aperture 0.15mm, thickness / aperture ratio of 4: 1
(3) wire width: Minimum width: gold plate 0.075mm, 0.10mm tin plate
(4) lead spacing: Minimum spacing: gold plate 0.075mm, 0.10mm tin plate
(5) gold plate: Ni layer thickness:> or = 2.5μ gold layer thickness: 0.05-0.1μm or according to customer requirements
(6) HASL: tin layer thickness:> or = 2.5-5μ
(7) paneling: Wire-to-edge minimum distance: 0.15mm hole to edge minimum distance: 0.2mm Minimum Shape tolerance: ± 0.12mm
(8) outlet chamfer: angle: 30 degrees, 45 degrees, 60 degrees Depth: 1 -3mm
(9) V cut: angle: 30 degrees, 35 degrees, 45 degrees Depth: 2/3 thickness minimum size: 80mm * 80mm
(10) off test:
Resistance to soldering heat: 85 --- 105 ℃ / 280 ℃ --- 360 ℃
Flexible sheet resistance flexing resistance / chemical resistance: full compliance with international standards
Inspection:
1. The main inspection hole metallization quality status, should ensure that the hole was no extra burr, black holes, holes and so on;
2. Check the substrate surface dirt and other unwanted objects;
3. Check the board number, drawing number, process documentation and process description;
4. clarify racking parts, racking requirements and can withstand the plating tank plating area;
5. plating area, the process parameters to be clear, to ensure the stability and viability of the electroplating process parameters;
6. conductive parts cleaning and preparation, the solution was presented first energization process active;
7. finds bath composition is checked, plate surface area status; such as the use of spherical anode bar installed, you must also check the consumption;
8. Check the voltage solid case and the contact area, the current fluctuation range.
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
