Introduction
Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
Material Types
FR-4, CEM-1,CEM-3, IMS, High TG,High Frequency, Halogen Free,Aluminum base, metal core base
Surface Treatment
HASL(LF), Flash gold, ENIG,OSP(Lead free compatible), Carbon ink,
Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger
Production Process
Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.
Application
LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.a
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Product Details:
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1.pcb file with parts list provided by customers
2.pcb boards made, pcb parts purchased by us
3.pcb boards with parts assembled
4.Electrinic Testing pcb or PCBA
We can copy pcb or PCBA if customers send samples to us
Layer:1-30 layer
Thickness:0.8mm
Finish coating:
Solder Mask:Green
Material: Fr-4
Min.Hole Size:0.1mm(4mil)
Min.Line width/Space:0.1mm/0.1mm(4mil/4mil)
Special Technique:Blind &buried via+Impedance control
Reference-Our Production Capability for Rigid PCB:
1 Layer: 1-30
2 Board finished thickness:0.21mm-7.0mm
3 Material: FR-4, CEM-1, CEM-3, High TG, FR4 halogen Free, Rogers
4 Max.finished board size:23*25(580*900mm)
5 Min.drilled hole size:3mil(0.075mm)
6 Min.Line width:3mil(0.075mm)
Min.Line spacing:3mil(0.075mm)
7 Surface finish/treatment: HASL/HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating.
8 Copper thickness:0.5-7.0 oz
9 Solder mask color: Green/yellow/black/white/red/blue
10 Copper thickness in hole: >25.0 um(>1mil)
11 Inner packing: Vaccum packing/Plastic bag
Outer packing: Standard carton packing
12 Shape tolerance:±0.13
Hole tolerance:PTH: ±0.076 NPTH: ±0.05
13 Cerificate: UL.ISO9001.ISO14001.SGS.ROHS.
14 Special requirements:Buried and blind vias+Controlled impedance+BGA
15 Profilling:Punching.Routing.V-CUT.Beveling
16 Provides OEM Services to all sorts of printed circuit board assembly as we as electronic encased products.
blind hoes PCB board
4-layer pcb
1:Material: FR-4, CEM-1, CEM-3
2 thickness:0.21mm-7.0mm
3:Cerificate: UL.ISO9001.ISO14001.SGS.ROHS
Product/Service: PCB, PCBA, printed circuit board, PCB assemble, SMT, FPCB, FPC, Rigid and Flex board, Rigid Printed circuit board.
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345