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Controlled Impedance High Density Interconnect PCB for Elevator / Heater 0.5 - 6oz

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Good quality Flexible PCB Board
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HDI PCB Board

  • High Precision HDI PCB Board suppliers
  • High Precision HDI PCB Board suppliers

 

 

Material


FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180

 

 

Surface Treatment


HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger

 

 

Advantage

 

1.PCB factory directly
2.PCB high quality
3.PCB good price
4.PCB quick time
5.PCB certification(ISO/UL E354810/RoHS)

 

 

Capability:

 

          -High Frequency (TACONIC material)/TG/Density/precision impedance controlled boards

          -Heavy Copper PCB, Metal based PCB. Hard Gold PCB, Blind &Buried vias boards,

Halogen Free PCB, Aluminum-backed Boards

          -Gold finger+ HAL & Leadfree HASL PCB, Leadfree compatible PCB

 

Controlled Impedance High Density Interconnect PCB for Elevator / Heater 0.5 - 6oz

Controlled Impedance High Density Interconnect PCB for Elevator / Heater 0.5 - 6oz
Controlled Impedance High Density Interconnect PCB for Elevator / Heater 0.5 - 6oz

Large Image :  Controlled Impedance High Density Interconnect PCB for Elevator / Heater 0.5 - 6oz

Product Details:

Place of Origin: China
Brand Name: LT Circuit
Certification: UL E354810,SGS

Payment & Shipping Terms:

Minimum Order Quantity: NO MOQ
Price: Negotiable
Packaging Details: 20pcs/vacuum bag+export packing
Delivery Time: 5-12Days
Payment Terms: L/C,T/T,Paypal
Supply Ability: Ten thousand square meters/month
Detailed Product Description
High Light:

high density board

,

custom circuit board

 

 

Controlled Impedance High Density Interconnect PCB for Elevator / Heater 0.5 - 6oz

 



Description

 

1. Professional manufacturer of PCB and PCB assembly specialized in single-sided PCB, double-sided PCB, multilayer PCB, PCB layout and design and PCB assembly

2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180

3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger

 

 

Application

 

Products are applied to a wide range of High-tech industries such as: LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect. By unremitting work and effort to the marketing, products exports to American, Canada, Europe counties, Africa and other Asia-pacific countries
 

 

Advantages

 

1. PCB factory directly

2. Comprehensive quality control system

3. Competitive price

4. Quick turn delivery time from 48hours.

5. Certificates (ISO/UL E354810/RoHS)

6. 9 years experience in exporting service

7. No MOQ/MOV.

8. High quality. Strict through the AOI(Automated Optical Inspection), QA/QC, flying porbe ,Etesting, etc

 

Specifications

 

 

High precision prototype

PCB bulk production

Max Layers

1-28 layers

1-14 layers

MIN Line width(mil)

3mil

4mil

MIN Line space(mil)

3mil

4mil

Min via (mechanical drilling)

Board thickness≤1.2mm

0.15mm

0.2mm

Board thickness≤2.5mm

0.2mm

0.3mm

Board thickness>2.5mm

Aspect Ration≤13:1

Aspect Ration≤13:1

Aspect Ration

Aspect Ration≤13:1

Aspect Ration≤13:1

Board thickness

MAX

8mm

7mm

MIN

2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm

2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm

MAX Board size

610*1200mm

610*1200mm

Max copper thickness

0.5-6oz

0.5-6oz

Immersion Gold/

Gold Plated Thickness

Immersion Gold:Au,1—8u”
Gold finger:Au,1—150u”
Gold Plated:Au,1—150u”
Nickel Plated :50—500u”

 

Hole copper thick

25um 1mil

25um 1mil

Tolerance

Board thickness

Board thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8%

Board thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8%

Outline Tolerance

≤100mm:+/-0.1mm
100< ≤300mm:+/-0.15mm
>300mm:+/-0.2mm

≤100mm:+/-0.13mm
100< ≤300mm:+/-0.15mm
>300mm:+/-0.2mm

Impedance

±10%

±10%

MIN Solder mask bridge

 0.08mm

 0.10mm

Plugging Vias capability

 0.25mm--0.60mm

 0.70mm--1.00mm

 

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