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Multilayer PCB Manufacturing Process FPC Board Flexible PCB Immersion Gold Yellow

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Good quality Flexible PCB Board
Good quality Flexible PCB Board
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The board quality is very good! We have been WonDa’s customer for more than 4 years. Your good service and quality is too good.

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Flexible PCB Board

  • High Precision Flexible PCB Board suppliers
  • High Precision Flexible PCB Board suppliers
  • High Precision Flexible PCB Board suppliers
  • High Precision Flexible PCB Board suppliers

 

 

Introduction:

 

Flex PCBs, also known as flexible printed circuits or flexible electronics, provide greater options for designers and engineers when assembling electronic circuits.

They are constructed from flexible, high-performance plastic material, usually polyimide, which enables the board to bend or "flex" during use. This flexibility opens them up to use in a wide range of applications.

Multilayer PCB Manufacturing Process FPC Board Flexible PCB Immersion Gold Yellow

Multilayer PCB Manufacturing Process FPC Board Flexible PCB Immersion Gold Yellow
Multilayer PCB Manufacturing Process FPC Board Flexible PCB Immersion Gold Yellow

Large Image :  Multilayer PCB Manufacturing Process FPC Board Flexible PCB Immersion Gold Yellow

Product Details:

Place of Origin: China
Brand Name: CHITUN
Certification: UL,ROHS,ISO
Model Number: base on customer spec.

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: Vacuum package
Delivery Time: quick turn and normal type
Payment Terms: TT, LC, Western Union, D/A,, D/P,and others base on negotiation
Supply Ability: 2, 000, 000PCS/week
Detailed Product Description
Material: PI Board Thickness: 20UM
SOlder Mask: Yellow Finished: Immersion Gold
Standard: IPC Standard
High Light:

flexible circuit boards

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flexible pcb prototype

Multilayer PCB Manufacturing Process FPC Board Flexible PCB Immersion Gold Yellow

 

  • Rigid-flex, flexible circuit
  • 1-12 layers
  • Width / space - 0,075mm single / double sided
  • Hole (mini) - drill (pth) 0,15mm / punch 0,5mm
  • Surface treatment - Ni / Au, ENIG, Tin plating
  • Peel strenght - adhesive 1,0 mil - 1,0 kg f/cm  IPC-TM 650 2.4.9

                                - adhesive 0,5 mil - 0,5 kg f/cm  IPC-TM 650 2.4.9

  • Solder float resistance - 270oC / 10 sec
  • Insulation resistance - 500 Mohm
  • Dielectric withstanding voltage - 500 V

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